3D computed tomography (CT) imaging is used for qualitative and quantitative defect analysis on an entire PCB and its components. CT can resolve each layer of a PCB individually so disconnects, delamination, and other defects can be detected within the PCB itself. It is possible to do volumetric, quantitative calculations for the solder fill on individual SMD and T/H components, thermal pads of QFNs and individual balls of BGAs and calculate bond wire defects, thickness and lengths. CT also allows for full 3D rendering of a component and its inner workings, such as bond wires. The CT process requires the sample to be clamped to a spindle and rotated 360 degrees while being held above the x-ray tube, so this is best used for small, light weight samples.